[1]徐凝华,吴义伯,刘国友,等.混合动力/电动汽车用IGBT功率模块的最新封装技术[J].控制与信息技术(原大功率变流技术),2013,(01):1-6.[doi:10.13889/j.issn.2095-3631.2013.01.001]
 XU Ning-hua,WU Yi-bo,LIU Guo-you,et al.The Latest Packing Technology for IGBT Module in HEV/EV Application[J].High Power Converter Technology,2013,(01):1-6.[doi:10.13889/j.issn.2095-3631.2013.01.001]
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混合动力/电动汽车用IGBT功率模块的最新封装技术()
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《控制与信息技术》(原《大功率变流技术》)[ISSN:2095-3631/CN:43-1486/U]

卷:
期数:
2013年01期
页码:
1-6
栏目:
综述·评论
出版日期:
2013-02-05

文章信息/Info

Title:
The Latest Packing Technology for IGBT Module in HEV/EV Application
文章编号:
2095-3631(2013)01-0001-06
作者:
徐凝华吴义伯刘国友窦泽春
株洲南车时代电气股份有限公司功率半导体研发中
Author(s):
XU Ning-hua WU Yi-boLIU Guo-youDOU Ze-chun
( Power Semiconductor R& D Centre of Zhuzhou CSR Times Electric Co., Ltd., Lincoln LN6 3LF, United Kingdom )
关键词:
IGBT 模块封装技术混合动力/ 电动汽车双面散热银烧结
Keywords:
IGBT module packaging technology HEV/EV double side cooling silver sintering
分类号:
TN605, U469.72
DOI:
10.13889/j.issn.2095-3631.2013.01.001
文献标志码:
A
摘要:
随着对功率密度和可靠性要求的不断提高,以及其苛刻的应用条件,混合动力/ 电动汽车使用的IGBT 功率模块需要采用新的封装技术。文章介绍了互连、芯片贴装、散热、模块结构等方面的最新技术,总结了功率模块未来的发展趋势,为国内同行了解并跟踪国际最新技术提供了参考材料。
Abstract:
As the requirements on power density and reliability have been constantly enhacing,and with the exacting application conditions, IGBT power modules applied in HEV/EV demand advanced packaging technologies. It introduced the latest technologies in the aspects of interconnection, die attachment, cooling and module structure, and summarized the future trend of power modules, which could provide the domestic engineers with some reference of understanding and tracking the international latest technologies.

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备注/Memo

备注/Memo:
收稿日期:2012- 10- 17
 作者简介:徐凝华(1984- ),男,硕士,工程师,现主要从事大功率半导体器件的模块设计及其先进封装技术研究工作。
更新日期/Last Update: 2016-10-10