[1]李 炘,周望君,奉 琴,等.IGBT 模块热特性测量与内部结构热特性分析[J].控制与信息技术(原大功率变流技术),2016,(02):26-29.[doi:10.13889/j.issn.2095-3631.2016.02.006]
 LIXin,ZHOU Wangjun,FENG Qin,et al.Measurement of Thermal Characteristics for IGBT Module and Thermal Characteristics Analysis of Its Inside Structure[J].High Power Converter Technology,2016,(02):26-29.[doi:10.13889/j.issn.2095-3631.2016.02.006]
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IGBT 模块热特性测量与内部结构热特性分析()
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《控制与信息技术》(原《大功率变流技术》)[ISSN:2095-3631/CN:43-1486/U]

卷:
期数:
2016年02期
页码:
26-29
栏目:
电力电子器件
出版日期:
2016-04-05

文章信息/Info

Title:
Measurement of Thermal Characteristics for IGBT Module and Thermal Characteristics Analysis of Its Inside Structure
文章编号:
2095-3631(2016)02-0026-04
作者:
李 炘周望君奉 琴王贤元
(株洲中车时代电气股份有限公司,湖南株洲 412001)
Author(s):
LIXinZHOU WangjunFENG QinWANG Xianyuan
(Zhuzhou CRRC Times Electric Co., Ltd., Zhuzhou, Hunan 412001, China)
关键词:
IGBT热特性 瞬态双界面测试法 结构函数
Keywords:
IGBT thermal characteristic transient dual-interface test method structure function
分类号:
TN386.2
DOI:
10.13889/j.issn.2095-3631.2016.02.006
文献标志码:
A
摘要:
IGBT 模块内部各层结构的热学特性容易受到外界条件(如封装工艺或封装原材料性能的变化等)的影响。文章利用结构函数的特性,经过对IGBT 实际测量和计算,获得模块内部的结壳热阻, 并根据不同材料的热阻和热容值对IGBT 模块内部每层结构进行热特性分析。
Abstract:
Thermal characteristics of IGBT module structure are easily influenced by outside conditions, such as changes of packing technology or raw material performance. In this paper, structure function was used to obtain the junction thermal resistance inside module via practical calculation and test. Then thermal characteristics analysis was made for each layer inside IGBT module, in accordance with thermal resistance and thermal capacitance of different materials.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期:2015-04-022
 作者简介:李炘(1988-),女,硕士研究生,现从事大功率IGBT 模块应用技术研究工作。
基金项目:国家自然科学基金项目(51490682)
更新日期/Last Update: 2016-05-17