[1]蒋云富,黄 南,袁 勇,等.集成式IGBT 功率组件的现状及发展趋势[J].控制与信息技术(原大功率变流技术),2015,(03):1-5.[doi:10.13889/j.issn.2095-3631.2015.03.001]
 JIANG Yunfu,HUANG Nan,YUAN Yong,et al.Status and Development Trends of Integrated IGBT Power Assembly[J].High Power Converter Technology,2015,(03):1-5.[doi:10.13889/j.issn.2095-3631.2015.03.001]
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集成式IGBT 功率组件的现状及发展趋势()
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《控制与信息技术》(原《大功率变流技术》)[ISSN:2095-3631/CN:43-1486/U]

卷:
期数:
2015年03期
页码:
1-5
栏目:
综述·评论
出版日期:
2015-06-05

文章信息/Info

Title:
Status and Development Trends of Integrated IGBT Power Assembly
文章编号:
2095-3631(2015)03-0001-05
作者:
蒋云富黄 南袁 勇陈燕平石廷昌
株洲南车时代电气股份有限公司,湖南 株洲 412001
Author(s):
JIANG Yunfu HUANG Nan YUAN Yong CHEN Yanping SHI Tingchang
Zhuzhou CSR Times Electric Co., Ltd., Zhuzhou, Hunan 412001, China
关键词:
IGBT功率组件集成互联散热电力电子集成模块智能化模块
Keywords:
IGBT power assembly integration interconnection heat radiation IPEM(integrated power electronics module) intelligent module
分类号:
TN6
DOI:
10.13889/j.issn.2095-3631.2015.03.001
文献标志码:
A
摘要:
文章归纳了提高集成式IGBT 功率组件集成度的3 种技术手段,包括新型散热设计、新型封装与互联, 以及驱动与控制高度集成。对现有技术流派分类剖析,探讨了集成式IGBT 功率组件的发展趋势,涉及高智能化与 PEBB 模块化设计。
Abstract:
It summarized three technical methods that could improve the integration level of integrated IGBT power assembly, which included the novel thermal design, packaging and interconnection and driver & control circuit integration. The current technology classification was analyzed. Furthermore, the development trends of IGBT power assembly were discussed, including high intelligent design and PEBB module design.

参考文献/References:

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更新日期/Last Update: 2015-06-30